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In the present article, we report a breakthrough approach for the rapid growth of whole void-free and highly preferred orientation Cu6Sn5 IMC interconnects of 50 µm thick by the current driven bonding (CDB) interconnect method and the use of a single crystal seeding substrate. There was no grain boundaries within the Cu6Sn5 IMC interconnect and no voids at both interfaces, which is beneficial for...
Characteristics of vacuum arc seriously influence the interruption ability of vacuum switches. In many cases (especially in commercial electrode systems), vacuum arcs are not completely axial symmetrical configuration. So, three-dimensional simulation of vacuum arc is needed. On the other hand, when the interruption current is very high, the anode will be in active state and becomes another source...
Electrode material seriously influences the characteristics of vacuum arc and further affects the performance of switches. In this paper, thermal processes of six kinds of metal anodes (including pure metal and alloy anodes) are simulated and researched. Two kinds of temperature calculation methods are used. Simulation results show that W and Mo anodes have the higher temperature than Cu, Cr, CuCr25...
Based on a steady 3D Magneto-Hydro-Dynamic (MHD) model, the high-current vacuum arc (HCVA) under combined effect of actual magnetic field (MF) and external transverse magnetic field (ETMF) is simulated. The actual MF is generated by cup-type AMF contact system. The ETMF may cause the deflection of arc column which is the main reason of the contact deflected erosion. According to some experimental...
In this study, the line-type Cu/Sn/Cu and Cu/Sn/Ni interconnects were used to determine the growth kinetics of interfacial intermetallic compounds (IMCs) under electromigration (EM), and the current crowding effect and thermomigration are expected to be avoided in this line-type interconnects because of their symmetric structure. The Cu/Sn/Cu interconnect was under the current density of 5.0×103 A/cm...
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