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Flip chip thermo-compression bonding (TCB) involves the use of heat and pressure to simultaneously form interconnections for microelectronic packaging. In-situ measurements of thermo-mechanical stresses that arise during this bonding process could provide unique insight to help better understand the TCB process. A 4mm×3mm×500μm complementary metal-oxide-semiconductor (CMOS) sensor chip with an 8×8...
Thermo-compression bonding (TCB) is an important electronic packaging process which applies heat and pressure to form arrayed interconnections in simultaneity. TCB processes need to be optimized to ensure low thermal variation in order to produce uniform and reliable bonds. Due to the form factors and complex structures involved in TCB, it is difficult to determine thermal variations during bonding...
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