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There are still many problems in the conductive adhesive, such as particle size and particle dispersion in the matrix, which can affect the stability of the electrical conductivity. In order to resolve the particle dispersion issue in the anisotropic conductive films (ACFs) during the bonding process, we need to increase capture rate of conductive balls between the top and the bottom metal electrodes...
In this paper, the electrical and reliability properties of various solder anisotropic conductive film (ACF) joints for flex-on-board (FOB) assembly using ultrasonic bonding were assessed in terms of short circuits, contact resistance, current handling capability, wetted solder areas, and reliability evaluation. It was found that the wetted solder areas increased and reliability was enhanced as the...
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