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In the present research, in order to fundamentally investigate the strength and interfacial microstructure of the joints between Sn-3.5Ag-0.7Cu (SAC) and Sn-8Zn-3Bi (SZB) solders and Cu, examinations using the standardized solder joint specimen for measuring the shear strength were performed. The effects of the addition of Ag, Bi and Pb to the solders, which are the ingredients of possible lead plating...
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