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This paper describes a versatile and reliable wafer-level hermetic packaging technology using an anodically-bondable low temperature cofired ceramic (LTCC) wafer, in which electrical feedthroughs and passive components can be embedded. The hermeticity of vacuum-sealed cavities was confirmed after 3000 cycles of heat shock (-40°C/+150°C, 30 min/30 min) by diaphragm method. The width of seal rings necessary...
We report 10-Gbit/s burst-mode clock and data recovery units for NRZ data format that use design-optimization, packaging, and bit-rate adjustment techniques. A fabricated unit operates at 9.953 Gbit/s with a wide bit-rate tolerance of 43 Mbit/s and a minimum preamble of only 9 bits.
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