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The wide band-gap (WBG) semiconductor electronics such as silicon carbide (SiC) and gallium nitride (GaN) are becoming more popular in power electronics applications due to their excellent functionality at higher operating temperatures, powers, frequencies and in high radiation environments compared to Si devices. However, the continued drive for higher device and packaging densities has led to extreme...
In the current paper, a high-performance cold plate based on single-phase jet impingement and mini-channel heat sink technologies is described for automotive electronics cooling. A manifold system with cylindrical connection tubes and tapered inserts is designed to distribute the coolant uniformly within an individual module and between three different modules. A two-level (local-global) modeling...
This paper is focused on the synthesis and application of optimized jet impingement target surfaces for electronics device cooling. A multiphysics topology optimization method is reviewed along with two-dimensional results for an optimal local jet impingement heat transfer surface. Multiple surface topologies are utilized as building blocks in the development of a three-dimensional cooling structure...
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