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This paper presents a reliability based optimization modeling approach demonstrated for the design of fine pitch ball grid array (fpBGA) structure. In this study the focus is on the strategy for handling the uncertainties in the package design inputs and their implementation into the design optimization modeling framework. The analysis of thermo-mechanical behavior of the package is carried out to...
It is well-known that high thermal stresses induced interfacial delamination is a typical failure mode in multi-layered micro-electronic components. Therefore, it is a key factor in package design to minimize interfacial stresses to enhance package reliability. In this paper, two designs of TAPP with different die attach pastes were manufactured. It was found that some test vehicles had cracks near...
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