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The easy oxidation of copper is one critical obstacle to high-performance copper-filled isotropically conductive adhesives (ICAs). In this paper, a facile method to prepare highly reliable, highly conductive, and low-cost ICAs is reported. The copper fillers were treated by organic acids for oxidation prevention. Compared with ICA filled with untreated copper flakes, the ICA filled with copper flakes...
The main hurdle for the wide use of Ag-filled isotropically conductive adhesives (ICAs) is the high cost of Ag fillers. Copper can be a promising candidate for conductive metallic filler due to its low cost, high electrical conductivity and improved electro-migration performance compared to Ag. But the oxidation of copper dramatically increases the resistivity of copper-filled ICAs which considerably...
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