The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
As consumers demand more functions in their hand-held devices, the need for more memory in a limited space is increasing. Over the past few years, die stacking has emerged as a powerful method for satisfying challenging IC packaging requirements. Traditionally, chip stacking was carried out with dies of different sizes so the top die was always smaller than the bottom die to permit wire bonding of...
Tin/silver/copper (SAC) solder alloys have been introduced as primary alternatives to the eutectic tin-lead solder. SAC alloys are relatively new alloy systems in packaging applications and existing studies are limited and confined mainly to the materials, assembly process, and finite element modeling. It is essential to conduct research focusing on the material aspects of the SAC alloy coupled with...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.