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As microelectronic system density continues to increase, cooling with conventional technologies continues to become more challenging and is often a limiter of performance and efficiency. The challenge arises due to both large heat fluxes generated across entire chips and packages, and localized hotspots with even higher heat flux. In this paper, nonuniform micropin-fin heat sinks are investigated...
Performance of the next generation microprocessors is rapidly reaching its limits due to inability to remove heat, especially at high power density from so-called local “hotspots”. Convective boiling heat transfer in microgap heat sinks has the potential to dissipate ultra-high heat fluxes. We report results of an experimental investigation of heat transfer performance of three dedicated microgap...
We report theoretical investigation and optimization of a hot-spot cooling method. This hybrid scheme contains a liquid cooling microchannel and superlattice hotspot cooler(s). This analysis of the hybrid method aims to solve the potential thermal management challenges for hotspots especially in 3D stacked multichip packaging. The goal is to reduce the overall cooling power and optimize the energy...
A MEMS-NEMS cooling device based on gas-assisted, thin-film evaporation and its experimental performance characterization are presented, aiming to dissipate large heat fluxes at low junction temperature for thermal management of hot spots in microprocessors. The salient feature of this cooling scheme that distinguishes it from other currently used microfluidic cooling techniques is an efficient combination...
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