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Crosstalk between the interconnects cause serious electromagnetic interference (EMI). The high density interconnects, including redistribution layers (RDLs) and through-silicon-vias (TSVs) in silicon interposer, require effective crosstalk-reduction signaling schemes. In this paper, a novel co-planar waveguide (CPW) RDL structure, where the ground lines directly contact the silicon substrate without...
High-density interconnects including redistribution layers (RDLs) and through-silicon-vias (TSVs) in silicon interposer require effective crosstalk-reduction signaling schemes. In this letter, a novel ground RDL lines structure utilizing ohmic contact is proposed for coupling mitigation, where the conventional insulator layer between the silicon substrate and the ground RDL lines is removed. An equivalent...
Through silicon via (TSV) is the critical structure for three dimensional package technology, which provides vertical interconnections between stacking dies and interposers. However, for TSVs, there are still some reliability problems and metal core warming of TSVs is involved in most of the causes. Thus, accurate and efficient thermal modeling methods describing and quantifying metal core warming...
Through silicon via (TSV) is the critical structure for three dimensional package technology, which provides vertical interconnections between stacking dies and interposers. However, for TSVs, there are still some reliability problems and metal core warming of TSVs is involved in most of the causes. Thus, accurate and efficient thermal modeling methods describing and quantifying metal core warming...
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