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Wafer reconstitution is a vital process for serving as a buffer to decouple the processing developments between IC fabrication and electronics packaging. By this approach, the IC packaging is then independent from the chip processing. However, such a process brings numerous mechanical loadings during molding and curing phases. Without carefully planning, failures such as die-shifting and excessive...
Iron chalcogenide compounds (FexSey) have regained considerable interest due to the recent discoveries of interesting properties, such as superconductivity in PbO-type FeSe1−x and huge coerciv-ity in monoclinic Fe3Se4 nanostructures [1-3]. There are two well-known magnetic compounds in this family: a hexagonal phase with the approximate composition of Fe7Se8 (H-phase) and a monoclinic phase with an...
Magnetic refrigeration based on themagnetocaloric effect (MCE) is a promising alternative to the conventional gas compression refrigeration, owing to its higher cooling efficiency, environmental friendliness, and compactness. The majority of research in this field is to seek materials that exhibit large MCE over a wide temperature range, with manufacturing flexibility, and are cost-effective. Among...
We study the signal enhancement at 1.53 μm in a high Erbium concentration, long lifetime single-crystal Erbium Chloride Silicate (ECS) nanowire. 644 dB/cm signal enhancement is measured from a single ECS nanowire via pump-probe method.
Integrated fan-out wafer-level packaging (InFO-WLP) technology with state-of-the-art inductors (quality factor of 42 and self-resonance frequency of 16 GHz) has been demonstrated for heterogeneous integration of digital and radio frequency (RF) systems. InFO-WLP promises superior form factor, pin count, and thermal performance to existing flip-chip ball grid array (FC-BGA) packages. In addition, InFO-WLP's...
Intermetallic compounds (IMCs) properties play a significant role in determining the reliability of solder joints in service. IMCs and their evolution become more important for devices with micro- or nano-scale joints used in cryogenic applications. In this study, the interfacial reactions of In/Cu and In/Ni/Cu due to low-temperature cycling are investigated. The results illustrate that the character...
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