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A 2.5D package is referred to as the packaging of multiple chips on an interposer made of silicon or glass featured with through-vias filled with copper as electrical interconnects. Thermal management remains a challenge due to the integration of dissimilar chips such as logic and memory chips on a common interposer in molded package format. In this paper, a partially molded 2.5D package (PM package)...
A Business Cloud is defined to be a collection of company datasets that are stored on the "Cloud". For simplicity, we have assumed: Each company only has one dataset. There are information flows among these datasets. Within such an environment Chinese Wall Security Policy (CWSP) is revisited. Based on the "physical" view of Brewer and Nash, the Chinese Wall policy that regulates...
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