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This paper presents a novel method to reduce the crosstalk induced delay in coupled carbon nanotube (CNT) bundle based through silicon vias (TSVs). A unique structure of mixed CNT bundled (MCB) TSV is proposed, wherein multi-walled CNTs (MWCNTs) are placed peripherally to the centrally located single-walled CNTs (SWCNTs). An electrical equivalent model is employed for analyzing these MCB configurations...
This research paper presents a new method to reduce crosstalk of carbon nanotube (CNT) bundle based through silicon vias (TSVs). For this, a unique structure of mixed CNT bundled (MCB) TSV is proposed with specific arrangement of single- (SWCNT) and multi-walled CNTs (MWCNTs). An equivalent electrical model is presented for different MCB configurations wherein MWCNTs are placed at peripheral layers...
Mixed carbon nanotube bundles (MCBs) are considered to be highly potential interconnect solutions in the current nanoscale regime. Different MCBs with random and spatial arrangements are proposed based on the placements of single- and multiwalled carbon nanotubes (CNTs) (SWNTs and MWNTs) in a bundle. Propagation delay and dynamic crosstalk performances are analyzed using the modified equivalent single...
This research paper observes dynamic crosstalk delay for different single and bundled carbon nanotube (CNT) structures. These CNT structures are implemented by using three coupled line bus architecture. HSPICE simulations are performed for different single and bundled single-walled and double-walled CNT (SWCNT and DWCNT) structures. A bundled DWCNT shows approximately 90.8% and 60.4% improvement in...
This research paper introduces a new modeling approach for different bundled CNT structures. Based on the arrangements of single- and multi-walled CNTs in bundle, two different structures of mixed CNT bundles (MCBs) are proposed. Performance in terms of propagation delay is compared between different bundled CNT structures by using a driver-interconnect-load (DIL) system. It has been observed that...
Multi-walled carbon nanotube (MWCNT) bundles have potentially provided attractive solution over Cu or other materials used in global VLSI interconnects. Initially, this research paper proposes an equivalent single conductor (ESC) of MWCNT which is well accurate to a multiple transmission line RLC network with an average error of 1.67% or below. Finally, a novel modeling approach of MWCNT bundles with...
This research paper presents a comparative analysis of power and delay performance between different bundled carbon nanotube (CNT) structures. An equivalent RLC model is developed for novel mixed CNT bundle structures that contains single- and multi-walled CNTs (SWCNTs and MWCNTs). Crosstalk delay and power dissipation have been compared for these proposed structures of mixed CNT bundles. It has been...
This research paper proposes a hierarchical modelling approach for mixed carbon nanotube (CNT) bundle (MCB) interconnects. Based on the arrangements of single-walled CNTs (SWCNT) and multi-walled CNTs (MWCNTs), three different MCB structures are proposed. Transient analysis is performed for bundled CNT structures to address the effect of propagation delay and power dissipation. It has been observed...
Multi-walled carbon nanotubes (MWCNTs) with higher number of shells have potentially provided attractive solution in propagation delay and power dissipation. This research paper presents an equivalent single conductor (ESC) model of MWCNT interconnect that is well accurate with any number of shells and distance from the ground plane. Using the ESC model, HSPICE circuit simulations have been performed...
This paper proposes a new modeling approach for mixed carbon nano tube (CNT) bundle (MCB) interconnects. An accurate modeling hierarchy has been proposed for MCB structures. Bundled single-walled CNTs (SWNTs) and multi-walled CNTs (MWNTs) have been modeled as equivalent single conductor (ESC) transmission lines and then combined to form a MCB interconnect. This MCB interconnect is basically a multiple...
Multi-walled carbon nanotubes (MWNT) have provided potentially attractive solution over single-wall carbon nanotube (SWNT) bundles at current very large scale integration (VLSI) technologies. This paper presents a comprehensive analysis of propagation delay for both MWNT and SWNT bundles at different interconnect lengths (global) and shows a comparison of equivalent number of SWNTs in bundle and shells...
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