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In semiconductor manufacturing processing, IC chips need to be shipped or transferred to EOL (End of Line), SMT (Surface Mounted Technology) or customers after assembly processing and final test. Before these processes, the dry packing is necessary which is also required by JEDEC (Joint Electron Device Engineering Council) standard. Generally, Tape & Reel packing is a typical method among lots...
A novel wideband circularly polarized antenna for S-band satellite communications with wide beamwidth is presented. The wide impedance bandwidth is achieved by using the modified inverted-L feeds and stacked patches. The wide beamwidth is obtained by the semi-open metal cavity. A prototype of the antenna is implemented, and the measured bandwidth is 30.1% with the reflection coefficient ...
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