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Being one of the most attractive 3-D integration solutions, through-silicon-vias (TSVs) electrically connect multiple strata of integrated circuits and/or devices in a vertical fashion. This paper examines the electrical performance of coaxial TSV, which is a new configuration that offers better signal integrity than other TSV structures. Various processing materials and physical geometries are considered...
Since the conventional planar ICs encountered many physical, technological and economic bottlenecks, 3D integration by stacking and connecting function blocks in a vertical fashion is regarded as a viable approach to alleviate such bottlenecks. Through-strata-via (TSV) is one of the most attractive 3D integration solutions, which offers a massive number of short interconnects, high bandwidth, reduced...
Magnetic induction tomography(MIT) is a noninvasive and contactless medical imaging technique. The 16 channels of MIT system is showed in the paper, which image for the low conductivity object with working at 1MHz. In the study, we use the water tanker filled with salt solution and the different conductivity agar blocks to simulate the human brain with edema or hematoma. The each sensor is composed...
Magnetic induction tomography is a new functional imaging technology. The eddy current analysis is the basic problem of the magnetic induction tomography forward problem. The eddy current distribution in a 2-D circle region was calculated in this paper. The expression of eddy current is composed of magnetic vector potential and scalar potential functions. The magnetic vector potential was calculated...
A 4-layers sphere model of human head was used to simulate human head. From outside to inside, the layers denoted scalp, skull, CFS and cerebra, respectively. The point current source placed on the outmost layer was regarded as the boundary condition, and the method of separation of variables was used to solve the electrical potential distributions in all layers. The electrical potential and the current...
An magnetic induction tomography (MIT) hardware system is introduced in this paper. The system is composed of nine parts: signal source, sensor coils, preamplifier, canceling circuit, difference circuit, lock-in amplifier and the controller. One-dimensional measurement has been made, the relation between the phase variety and the conductivity of sample was constructed. A rectangular water-tank was...
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