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In this paper, a new efficient methodology is used to model dense via arrays in 3D integrated circuit and package system, which also can include the layout of multiple vias sharing the same antipad. In order to accurately calculate all the effects of high order waveguide modes and azimuthal modes for complete signal integrity analysis of multiple closely spaced vias, we make use of transformation...
When a high-speed signal transits through a via that penetrates a plane pair, parallel-plane resonances can cause additional insertion loss for the signal. To eliminate this via-plane coupling, ground vias are added adjacent to the signal via. This paper discusses the impact of the ground vias as a function of the number of the ground vias, their locations, and the size of the plane pair. A block-by-block...
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