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For memory devices, focus has been on Ag alloybonding wire as a low-cost alternative to Au bonding wire. However, Ag bonding wire has lower long-term bond reliabilitythan Au bonding wire under high temperature and humidityconditions. Past research has mainly been concerned withenhancing the bond reliability by Pd doping into the Agbonding wire. On the other hand, Ag-Pd alloy bonding wire haspractical...
Pd coated copper (PCC) wire and Au-Pd coated copper (APC) wire have been widely used in the field of LSI device. Recently, higher bond reliability at high temperature becomes increasingly important for on-vehicle devices. However, it has been reported that conventional PCC wire caused a bond failure at elevated temperatures. On the other hand, new-APC wire had higher reliability at higher temperature...
There is growing interest in Cu wire bonding for LSI interconnection due to cost savings and better electrical and mechanical properties. Conventional bare Cu bonding wires, in general, are severely limited in their use compared to Au wires. A coated Cu bonding wire (EX1) has been developed for LSI application. EX1 is a Pd-coated Cu wire to enhance the bondability. Bond reliability at a Cu wire bond...
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