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This paper presents, for the first time, characterization results of next generation dielectric core and build up material called RXP, which has low dielectric constant (2.93-3.48) and low loss tangent (0.0037-0.006) up to 110 GHz. Unlike LCP, this material can be made ultra-thin with low processing temperature and is ideally suited for mobile applications. Causal models suitable for high frequency...
In this paper we present an ultra-high wiring density build-up substrate targeted at 30 mum IC-to-substrate interconnect pitch, using a new low loss thin core laminate (RXP-1) and low dielectric constant and low loss thin build up dielectric (RXP-4). The RXP-1 core is a glass fiber reinforced organic laminate with a thickness in the range of 50-110 mum. The RXP-1 core has a stable dielectric constant...
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