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Blind through-silicon-vias (TSVs) with low cost polyimide dielectric liner formed by vacuum-assisted spin coating technique were successfully fabricated, and capacitance-voltage characteristics were evaluated. The diameter of the fabricated TSV is around 6.7 µm and depth around 54 µm. Minimum step coverage of the polyimide dielectric liner is around 30% Minimum capacitance of each blind TSV is around...
The V–Cu composite oxide catalyst was prepared by coprecipitation and used for the synthesis of diphenyl carbonate (DPC) by transesterification of dimethyl carbonate (DMC) with phenol. The effect of the molar ratio of V:Cu and the reusability of the catalyst were investigated. The catalyst showed the highest activity at a V:Cu molar ratio of 4:1. Under the conditions of 150–180°C and 9 h, the conversion...
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