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During the process of power electronic packaging, the warpage of substrate is one of the key parameters in affecting the quality and reliability of microelectronics products. In order to develop the reliability of microelectronics products and reduce the costs, the measurement of the warpage of microelectronics components is essential. In this paper, an array of DBC substrate which two edges were...
During the process of power electronic packaging, the warpage of substrate is one of the key parameters in affecting the quality and reliability of microelectronics products. In order to develop the reliability of microelectronics products and reduce the costs, the measurement of the warpage of microelectronics components is essential. In this paper, an array of DBC substrate which two edges were...
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