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Surface smoothening by substrate annealing was studied as a pre-treatment for improving the corrosion protection provided to copper by 10, 20 and 50nm thick alumina coatings deposited by atomic layer deposition. The interplay between substrate surface state and deposited film thickness for controlling the corrosion protection provided by ultrathin barrier films is demonstrated. Pre-annealing at 750°C...
The effect of the interfacial air-formed native copper oxide layer on the corrosion protection of copper with 20nm Atomic Layer Deposited (ALD) alumina was investigated in 0.5M NaCl using electrochemical and surface analysis techniques. The results show that dissolution of the interfacial native oxide by a pre-treatment of the copper substrate with phosphoric acid is beneficial to the sealing property...
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