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Cu and Ti films were deposited by sputtering on thermally oxidized Si wafers and then the deposited films were bonded by direct Cu-Cu thermo-compression bonding for evaluating the effect of the wet pre-treatment on the interfacial adhesion energy. The interfacial adhesion energy was evaluated as 0.29, 1.28, 1.64, 1.17, and 0.42 J/m2 by acetic acid pretreatment at 35degC for 0, 1, 5, 10, and 15 min...
In this study, the adhesion and interface characteristics of NiCr/Cu metal film on PI film modified by O 2 ion beam were investigated. The surface modification of PI film by O 2 ion beam enabled a significant decrease of contact angles of water from 68° to 4.4° at an ion dose of 1×10 18 ions/cm 2 , which resulted in an increase of surface energy by a factor of two...
Nano-patterns made of poly(methyl methacrylate) (PMMA) were fabricated on silicon wafer using a capillarity-directed soft lithographic technique. Patterns with three different aspect ratios were investigated for their adhesion and friction properties at nano-scale and for friction at micro-scale. The patterned samples exhibited superior tribological properties, at both these scales when compared to...
A copolymer of t-butyl 5-norbornene-2-carboxylate, 2-(2-methoxyethoxy)ethyl 5-norbornene-2-carboxylate, norbornene, and maleic anhydride was synthesized as a matrix polymer for ArF excimer laser lithography. Hydrophilic 2-(2-methoxyethoxy)ethyl ester groups are introduced into side chains of the matrix polymer in order to improve adhesion to a silicon substrate without causing cross-linking during...
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