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In the paper, an equivalent modeling method is proposed to simplify thermal simulation model of 2.5D stacked dies modules. A TSV and its surrounding silicon substrate or a micro bump and its surrounding underfill will be equivalent to a single body of material. Through this method, we will not only be able to obtain thermal characteristics of each part of the stacked dies module, but also can greatly...
This work focused on the electromigration (EM) behavior of the Cu/Sn-58Bi/Cu solder joint affected by the large void formation. The as-reflowed one-dimensional solder joint was stressed with current density of 5×103 A/cm2 at 80°C continuously for 144h. The microstructural evolution was observed and analyzed by SEM. Results indicated that the abnormal Sn/Bi phase segregation was observed at the cathode...
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