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Three methods for fabricating thin film capacitors are investigated using sputtering, sol-gel, and atomic layer deposition (ALD) techniques for advanced packaging applications for embedded capacitors. In particular, the microstructures and the electrical properties of ceramic oxide films Au/Ti/Al2O3 for ALD are being studied while ferroelectric thin films Au/Ti/BaTiO3 for sol-gel and Cu/Ba1 - xSr...
Three methods for fabricating thin film capacitors are investigated using sputtering, sol-gel, and atomic layer deposition (ALD) techniques for advanced packaging applications for embedded capacitors. In particular, the microstructures and the electrical properties of ceramic oxide films Au/Ti/Al2O3 for ALD are being studied while ferroelectric thin films Au/Ti/BaTiO3 for sol-gel and Cu/Ba1-XSrXTiO...
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