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Aurrion heterogeneous platform combines best-in-class active III–V materials for lasers, modulators and photodetectors with advanced passive components on a single chip. By leveraging existing silicon industry infrastructure for manufacturing and packaging, low-cost photonics can be closely integrated with electronics in system-in-package solutions. Such solutions are well suited to meet the demands...
Datacenters are demanding dramatic increases in the volume and density of optical interconnections, requiring multiple high performance lasers, modulators, and photodiodes in a single module to meet growing bandwidth needs along with dramatically lower power and cost. The heterogeneous integration of InP material into a silicon photonics wafer flow enables high performance integrated circuits to be...
The device and integration technology for silicon photonic transmitters are reviewed in this paper. The hybrid silicon platform enables on-chip lasers to be fabricated with silicon photonic circuits and can be integrated in the CMOS back-end flow. Laser arrays from multiple die bonding and quantum well intermixing techniques are demonstrated to extend the spectral bandwidth from the laser array of...
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