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The wafer level chip scale packaging (WLCSP) is a new concept package in which the entire assembly process is completed at the wafer level. The WLCSP fulfills the demand for small, light, and portable handheld electronic devices. The WLCSP is one of the most advanced packaging concepts. The board level reliability is the key issue for the WLCSP, especially for the evaluation of the thermal fatigue...
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