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In order to solve the vibration during the process of transferring wafers and achieve the purpose of transferring wafers accurately and stably, the wafer transfer robot dynamic model was modelled and the strategy of vibration suppression based on input shaping was proposed. Based on the characteristics of wafer transfer robot, ZV input shaper and skewed shaper was designed to solve the single axis's...
During the processing of wafer, in order to avoid the friction between wafer and wafer box, and to guarantee the clean state of the working environment simultaneously, small contour error and little vibration are required for wafer transfer robot to deliver wafer, i.e., to achieve stable and accurate trajectory for wafer delivery. To lessen contour error, suppress vibration, a kind of control algorithm...
A composite two-dimension ultrasonic vibration system with parallel structure is presented in this paper for the wire bonding application. Compared with other conventional structures, this one uses the structure of the clamping beam, weakening the horizontal deflection stiffness, instead of the clamping ring, which weakens the coupling effects existing in most parallel structures. By means of the...
A composite ultrasonic energy transmission system with the serial structure horn is presented for the wire bonding application. Compared with the conventional parallel structures, this one can greatly reduce the structural coupling effect. Energy density formulation is deducted theoretically. Through the vibration characteristic analysis and FEA verification, it is proved that this serial structure...
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