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In the wire bonding process of MEMS packaging, Heat Affect Zone (HAZ) is the important factor governing the loop profile of bonding. The height of loop is affected by the length of the HAZ. Factors governing the HAZ are studied. To investigate this relationship, the experiments were done for the various sizes of wire diameter and Free Air Ball (FAB). Electric Flame-Off (EFO) current, EFO time, EFO...
With the increasing demand of high speed and precision positioning system for the devices packaging in microelectromechanical system (MEMS), a novel high speed nanometer positioning XY stage system on macro/micro driven is presented in this paper. The stage integrates the advantage of macro stage driven by linear voice coil motor (VCM) such as long stroke and high speed, and the advantage of micro...
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