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In this paper, a bump-less high-speed through silicon via (TSV) channel is proposed for terabyte/s bandwidth 2.5D IC. The signal integrity of the proposed channel is analyzed based on the frequency and time domain simulation. To analyze the signal integrity of the proposed channel minutely, the proposed channel and the conventional channel are simulated and compared respectively. Moreover, unlike...
Through silicon via (TSV) based 3-dimensional integrated circuit (3D IC) has become the key solution to satisfy continuously increasing demands for small form factor, wide bandwidth, high performance, and low power consumption on electronic devices. However, there still remain several challenges to be solved; one of the most significant issues in 3D IC is TSV to active circuit noise coupling. In this...
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