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As microelectronic system density continues to increase, cooling with conventional technologies continues to become more challenging and is often a limiter of performance and efficiency. The challenge arises due to both large heat fluxes generated across entire chips and packages, and localized hotspots with even higher heat flux. In this paper, nonuniform micropin-fin heat sinks are investigated...
Dynamic operation and control is an essential tool for thermal management of a number of next generation electronic devices that suffer from localized hotspots with large heat fluxes. Due to limited cooling resources, the time that high heat flux devices can operate before load mitigation approaches must be employed is limited. To mitigate the spatial and temporal non-uniformities in chip temperature...
We report theoretical investigation and optimization of a hot-spot cooling method. This hybrid scheme contains a liquid cooling microchannel and superlattice hotspot cooler(s). This analysis of the hybrid method aims to solve the potential thermal management challenges for hotspots especially in 3D stacked multichip packaging. The goal is to reduce the overall cooling power and optimize the energy...
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