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A hybrid cooling scheme utilizing superlattice coolers (SLCs) along with microchannel heat sink for thermal management of hotspots is presented. In this paper, we have studied the effect of operating and design parameters on the performance of the SLC. We have also experimentally investigated the effect of interface thermal resistance as well as thermal resistance between the ground electrode and...
Thermal coupling between superlattice coolers (SLCs) in an array adversely affects performance of an each individual cooler compared with an isolated device. Here, we have developed an electrothermal model to study this coupling between SLCs and how it is affected by geometric parameters such as separation between the superlattice structure and a ground electrode, and operating parameters such as...
We report theoretical investigation and optimization of a hot-spot cooling method. This hybrid scheme contains a liquid cooling microchannel and superlattice hotspot cooler(s). This analysis of the hybrid method aims to solve the potential thermal management challenges for hotspots especially in 3D stacked multichip packaging. The goal is to reduce the overall cooling power and optimize the energy...
Thermal management of high performance microprocessors is becoming increasingly challenging due to the presence of hotspots. Temperature at the hotspot can be substantially greater than rest of the microprocessor, potentially compromising performance and reliability. In this paper, we have presented a hybrid cooling scheme which combines microfluidic and solid-state cooling techniques. Localized hotspot...
A MEMS-NEMS cooling device based on gas-assisted, thin-film evaporation and its experimental performance characterization are presented, aiming to dissipate large heat fluxes at low junction temperature for thermal management of hot spots in microprocessors. The salient feature of this cooling scheme that distinguishes it from other currently used microfluidic cooling techniques is an efficient combination...
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