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There are a number of emerging electronic applications that are thermally limited and may exhibit high overall power dissipation (“background”) combined with local very high power fluxes (“hotspot”). We have batch fabricated a microfluidic heat sink specifically designed to address both levels of heat removal. A microgap for hotspot cooling and micropin-fins are sequentially deep etched in a silicon...
We report theoretical investigation and optimization of a hot-spot cooling method. This hybrid scheme contains a liquid cooling microchannel and superlattice hotspot cooler(s). This analysis of the hybrid method aims to solve the potential thermal management challenges for hotspots especially in 3D stacked multichip packaging. The goal is to reduce the overall cooling power and optimize the energy...
We report a study on a liquid-thermoelectric hybrid cooling that allows a multiple larger heat flux (>600 W/m2) hotspots on a chip that is never achievable with a reasonable pump power for a microchannel with single phase liquid cooling. Thermoelectric effect is realized in this study by embedding to the silicon chip in superlattice microcooler which has been studied in our previous work. We went...
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