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As microelectronic system density continues to increase, cooling with conventional technologies continues to become more challenging and is often a limiter of performance and efficiency. The challenge arises due to both large heat fluxes generated across entire chips and packages, and localized hotspots with even higher heat flux. In this paper, nonuniform micropin-fin heat sinks are investigated...
For a number of demanding applications, the performance of electronic devices is hampered by the inability to remove generated heat at a sufficient rate to increase transistor density or operating frequency without exceeding thermal limits. Two-phase cooling, in particular thin film evaporation, exploits the latent heat of phase change to provide an effective means for high heat flux dissipation while...
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