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Understanding two-phase convective heat transfer under extreme conditions of high heat and mass fluxes and confined geometry is of fundamental interest and practical significance. In particular, next generation electronics are becoming thermally limited in performance, as integration levels increase due to the emergence of ‘hotspots’ featuring up to ten-fold increase in local heat fluxes, resulting...
Performance of the next generation microprocessors is rapidly reaching its limits due to inability to remove heat, especially at high power density from so-called local “hotspots”. Convective boiling heat transfer in microgap heat sinks has the potential to dissipate ultra-high heat fluxes. We report results of an experimental investigation of heat transfer performance of three dedicated microgap...
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