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The microstructural changes on the surface of Cu/Sn-58Bi/Cu interconnects, under current stressing of 2.7 times 104A/cm2 95degC for 60 hrs, are examined in this paper. At the anode side, the Bi phase accumulated in front of the intermetallic compound (IMC), and bumps of Bi rich solder extruded out of the surface along the IMC/solder interface. At the cathode side, a Bi depleted zone appeared, which...
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