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With regulations mandating industry toward Pb-free solders in all electronics, the development of interconnecting materials capable of withstanding harsh thermal conditions becomes one of the key technological elements for the development of next generation wide band-gap semiconductors. By reflowing Ni/Sn/Ni interconnects under temperature gradient, a new transient liquid phase (TLP) bonding process...
Synchrotron radiation real-time imaging technology was performed to in situ study the effect of Cu-Ni cross-solder interaction on liquid-solid interfacial reaction in Cu/Sn-3.0Ag-0.5Cu/Ni micro interconnects at 221 °C. For Cu/Sn-3.0Ag-0.5Cu interconnect, the scalloped IMC remained its shape grew slightly larger with prolonged reaction time. However, with Ni substrate added on the opposite interface,...
Novel Sn-rich Au-Sn solder alloys were designed using the cluster-plus-glue-atom (CPGA) model and calculation of phase diagrams (CALPHAD) method, and the melting behavior, microstructure, wettability and interfacial reactions of the designed Sn-Au-Ag solders were systematically investigated. The melting temperature of Sn-Au-Ag solder is among the range of 205.86 to 206.63 °C. The microstructure of...
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