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The growth kinetics of the TiC reaction layer during active brazing of diamond with Cu–Sn–Ti and Ag–Cu–Ti based filler alloy has been investigated by kinetic simulations and comparing with available experimental data. First, to obtain a reliable mobility database, the atomic mobilities of C and Ti in fcc (face-centered cubic) TiC are assessed using software DICTRA based on available diffusion data...
Based on the available thermodynamic information and diffusion coefficient data of the Cu–Sn binary system, the atomic mobilities of Cu and Sn in face-centered cubic (fcc) Cu–Sn alloys have been assessed as a function of temperature and composition in terms of the CALPHAD method using the DICTRA ® software package. Optimized mobility parameters are presented. To testify the reliability of...
On the basis of the available thermodynamic parameters and experimental data of tracer diffusivity, intrinsic diffusivity and chemical diffusivity in the Cu–Ni binary system, the atomic mobilities of Cu and Ni in face-centered cubic (fcc) Cu–Ni alloys have been assessed as a function of temperature and composition using the CALPHAD approach and DICTRA software package. Comparisons between the calculated...
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