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The interfacial microstructure evolution and shear strength of SiC joints for high temperature applications diffusion bonded by spark plasma sintering with a Ta-5W interlayer in the temperature range of 1500°C to 1700°C were investigated. The interfacial microstructure analysis indicated that (Ta,W)C phase formed initially and (Ta,W)-Si intermetallic compounds subsequently at SiC/Ta-5W interface....
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