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This paper presents an innovative intelligent power module in a molded dual-in-line package. It combines new reverse conducting IGBTs and a silicon-on-insulator (SOI) gate drive IC. It features internal schematics using the combination of PCB and lead-frame without using expensive heat transfer materials, such as ceramics. We provide a description of the module, its dimensions, and its internal schematics...
This paper presents a new CIPOS™ (Control Integrated Power System) in DIL (Dual-in-line) package, which combines with the features of Infineon trench field stop RC (Reverse conducting) IGBT and a newly optimized Infineon SOI (Silicon On Insulator) gate driver to achieve the excellent solution for upto 2.5kW motor drives. It also comes along with flexible internal schematics, which are tailor made...
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