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A 1.0 ??m CMOS technology with 3 layers of metal is used to implement a high density Master Image that contains LOGIC and RAMs. The Image allows the usage of even more than 1,000,000 transistors. A hierarchical design methodology is described. This chip offers variable sized physical partitions and RAM macros. No fixed area sizes and locations for partitions and macros are necessary. Chip density...
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