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The vulnerability of a network may suffer tremendous economic losses. From the perspective of network nodes, network security depends not only on the behavior of a node but also on that of its neighbours. We propose a non-cooperative networking vaccination game with economic incentive mechanism under a susceptible-infected-susceptible (SIS) epidemic process. In the game each node individually decides...
Realization of accurate real-time predictions of infectious diseases is an important but challenging task, because spatial transmission among networked populations is stochastic and time-varying. In this paper, we propose a new algorithm to predict the susceptible subpopulations which will be infected in the next time step at the early stage of an epidemic on a metapopulation network by using data...
Energy harvesting point-to-point communications are considered. The transmitter harvests energy from the environment and stores it in a finite battery. It is assumed that the transmitter has always data to transmit and the harvested energy is used exclusively for data transmission. As in practical scenarios prior knowledge about the energy harvesting process might not be available, we assume that...
To uncover the process of spatial invasion of infectious diseases, it is vital to reconstruct the epidemic invasion pathways among subpopulations, which is the central interest of this work. The process inference is a challenging problem due to the complexity of spreading process on networked metapopulation. With the epidemic arrival time (EAT) infected series of each subpopulation, an invasion pathway...
High frequency ultrasonic transducer with operating frequency over 200 MHz has been fabricated using a composite sol gel technique. Piezoelectric lead-free thick film was prepared by dispersing the crystalline fine KNN powder into BNT precursor solution to form composite slurry which was spin-coated on the platinum buffered Si substrate. The resultant KNN/BNT film with thickness of 8 μm exhibited...
A pre-shaped wafer level packaging strategy for RF MEMS is presented. Silicon wafer is used as the capping chip for packaging of the Coplanar Waveguide (CPW) lines on the SCHOTT BOROFLOAT® 33 glass substrate. The capping wafer is etched simultaneously from both sides which are carefully designed. One side is formed to on-chip cavities that will capsulate the RF MEMS devices; the other side is formed...
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