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A pre-shaped wafer level packaging strategy for RF MEMS is presented. Silicon wafer is used as the capping chip for packaging of the Coplanar Waveguide (CPW) lines on the SCHOTT BOROFLOAT® 33 glass substrate. The capping wafer is etched simultaneously from both sides which are carefully designed. One side is formed to on-chip cavities that will capsulate the RF MEMS devices; the other side is formed...
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