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Reservoir length dependencies of electromigration lifetime in multilevel interconnect were compared for two passivation dielectrics, i.e., flowable oxide (FOX) and high density plasma fluorinated silicate glass (HDP FSG). These results were analyzed mainly by both X-ray diffraction (XRD) and finite element method (FEM) for determination of the mechanical stress in Al-Cu interconnect lines. Also, it...
Both X-ray diffraction and finite element analyses were used to investigate the effects of various passivation dielectrics and metal line aspect ratios on the mechanical stress in Al-Cu interconnect lines. Volume-averaged stresses were measured and calculated by considering not only residual stresses and mechanical properties of passivation dielectrics but also their characteristic deposition shapes...
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