The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Sn2.5Ag0.7Cu0.1RE/Cu solder joints were obtained with ultrasonic vibration assisted. Microstructure and properties of the joints were studied. Experimental results show that reliable soldering of Sn2.5Ag0.7Cu0.1RE/Cu can be achieved under condition of ultrasonic power of 88 W and low-halogen flux. The maximum shear strength of 26.0 MPa is obtained from the joint soldered at ultrasonic vibration time...
Sn2.5Ag0.7Cu0.1RE/Cu solder joints were obtained with ultrasonic vibration assisted. Microstructure and properties of the joints were studied. Experimental results show that reliable soldering of Sn2.5Ag0.7Cu0.1RE/Cu can be achieved under condition of ultrasonic power of 88 W and low-halogen flux. The maximum shear strength of 26.0 MPa is obtained from the joint soldered at ultrasonic vibration time...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.