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Sn-8Zn-3Bi solder balls with different weight percentages of Sn-Ag-Cu addition were bonded to Au/Ni metallized Cu pads, and the effect of multiple reflow and aging on impact reliability was investigated. In the Sn-Ag-Cu content Sn-Zn-Bi solder joints, the AgZn3 intermetallic compound layer was clearly observed at the interfaces and its thickness increased with an increase the number of reflow cycles...
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