The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The Au/Cu film was prepared by vacuum evaporation plating method and patterned by the standard lithography process. The eutectic SnPb solder ball was reflowed on the designed film pattern with H2 protection. The liquid solder would flow along the Au/Cu zones and the final wetting shape reflected the original structure of the pattern. The liquid film was extended ahead of the main liquid front and...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.