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As the continuously development of microelectronics industry, higher demand has been put forward toward the electronic packing technology. Being one of the three most important packaging materials (lead frame, spun gold, Epoxy Molding Compound) used for semiconductor, EMC has directly affected the performance of the semiconductor product. In this article, the transistor (model SOT32) was researched...
The reliability of integrated circuit (IC) packages depends in many respects on their mechanical integrity. The effect of structural weaknesses caused by poor bonding, voids, microcracks or delaminations may not be evident in the electrical performance characteristics, but may cause premature failure. C-mode scanning acoustic microscopy (C-SAM) is an excellent tool for non-destructive failure analysis...
Aimed at the problem of In/Au solder joints in microwave circuit, the microstructure and components of In/Au solder joints were analyzed and the failure modes for die bonding by In/Au were documented. The failure causes were discussed and preventive measures were suggested. Non-control of temperature and oxidation of solder lead to decrement of the die shear strength: if the bonding temperature is...
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