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This paper presents the design of a ball grid array package and more importantly describes the integration of a microstrip grid array antenna in the package in a low temperature cofired ceramic (LTCC) technology for a single-chip 60-GHz receiver. The grid array package has a small volume of 13.5 × 8 × 1.265 mm3 and can house a 60-GHz receiver die of current size. The package samples were fabricated...
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