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Fiber optic interconnection processes and hybrid integration of electronic devices for high speed Si photonic systems are presented. Thermal effects arising from these hybrid integration processes are also investigated. An overview of ePIXfab which offers affordable access to an advanced Si photonic foundry service is also presented. This includes the presentation of fundamental photonic packaging...
Fibre optic interconnection processes and hybrid integration of electronic devices for highspeed Si photonic systems are presented. An overview of ePIXfab which offers affordable access to an advanced Si photonic foundry service is also presented.
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